微米氮化硼对有机硅改性环氧树脂基轻质绝缘材料热特性及电气性能影响研究  

Effect of Micro Boron Nitride on Thermal and Electrical Prosperities of Silicone Modified Epoxy Based Light-weight Insulated Materials

作　　者：刘云鹏[1] 李乐[1] 刘贺晨[1] 周松松 解卓鹏 刘磊 唐力 黎小林 LIU Yunpeng;LI Le;LIU Hechen;ZHOU Songsong;XIE Zhuopeng;LIU Lei;TANG Li;LI Xiaolin(Hebei Provincial Key Laboratory of Distributed Energy Storage and Microgrid(North China Electric Power University),Baoding 071003,Hebei Province,China;China Electric Power Research Institute,Haidian District,Beijing 100192,China;Electric Power Research Institute,China Southern Power Grid,Guangzhou 510080,Guangdong Province,China)

机构地区：[1]河北省分布式储能与微网重点实验室(华北电力大学),河北省保定市071003 [2]中国电力科学研究院有限公司,北京市海淀区100192 [3]南方电网科学研究院有限责任公司,广东省广州市510080

出　　处：《中国电机工程学报》2021年第12期4342-4353,共12页Proceedings of the CSEE

基　　金：南方电网科研院科技项目(SEPRI-K195067);中央高校基本科研业务费专项资金资助(2020MS088,2018QN073)。

摘　　要：树脂/空心填料复合材料作为一种重要的轻质绝缘材料体系具有广阔的发展前景,然而由于其特殊的生产工艺以及高电压等级长期运行的需求,对材料的综合性能提出了日益严苛的要求。该文在有机硅改性环氧树脂/聚合物微球复合材料体系中引入微米氮化硼改性,研究不同氮化硼用量对复合材料热性能和电气性能的影响。研究发现,材料热性能随着微米氮化硼增加而显著提高,添加氮化硼含量为16%时,其热导率提高79%, 50℃时热膨胀系数下降至20.57ppm/℃,这一数值已与玻璃钢接近。此外,得益于氮化硼优异的自身电气性能与良好的界面结合程度,填充后100h水扩散后泄漏电流低于30mA,交流击穿强度大于10kV/mm,同时介电损耗仍维持在相对较低水平-(~10^(-3))。结果显示出氮化硼改性后复合材料具有优异的热稳定性和综合电气性能,这为解决轻质绝缘材料体系工艺问题及拓展其应用领域提供了新的思路。Resin/microsphere composites were referred to as promising candidates in the light-weight electrical insulation application. However, in order to meet the requirements of the high voltage application, it is still difficult to solve the problems of the special fabrication process and long-term stability issues, which involve heat concentration issues and explosive polymerization issues. In this paper, micron boron nitride(BN) was added into silicone modified epoxy resin/polymer microsphere composites, and the effects of various BN content on the thermal and electrical characteristics of the composites were studied. The outcomes demonstrated that the thermal properties of the materials were substantially improved with the increase of micro BN. When the BN content was 16%, the thermal conductivity increases by 79%;the coefficient of thermal expansion decreases to 20.57 ppm/℃ at 50℃, which was near to that of glass fiber reinforced plastics. Moreover, because of the outstanding electrical properties of BN and good interfacial bonding degree, after 100 h of the water diffusion process, the leakage current of the composites was less than 30mA, the AC breakdown strength was greater than 10 kV/mm, and the dielectric loss was still comparatively-low(~10^(-3) level). All the outcomes indicated that the BN improved comprehensive electrical properties, providing a new idea for resolving the process issues of resin/microspheres materials.

关 键 词：轻质绝缘材料 微米氮化硼 有机硅改性环氧树脂 热膨胀系数 泄漏电流 

分 类 号：TM85[电气工程—高电压与绝缘技术]