硼硅玻璃在氧化铝陶瓷上的高温润湿行为与界面结合性能  

High-temperature wetting behavior and interfacial bonding properties of borosilicate glass on alumina ceramic substrate

作　　者：刘炘城 邵海成 乔冠军[1] 陆浩杰 刘桂武[1] LIU Xincheng;SHAO Haicheng;QIAO Guanjun;LU Haojie;LIU Guiwu(School of Materials Science and Engineering,Jiangsu University,Zhenjiang,Jiangsu 212013,China)

机构地区：[1]江苏大学材料科学与工程学院,江苏镇江212013

出　　处：《江苏大学学报（自然科学版）》2021年第4期485-490,共6页Journal of Jiangsu University：Natural Science Edition

基　　金：国家重点研发计划项目(2017YFB0310400);国家自然科学基金资助项目(51572112);先进耐火材料国家重点实验室开放基金资助项目(SKLAR201903)。

摘　　要：采用硼硅玻璃作为焊料,氧化铝陶瓷片作为基底,研究了玻璃焊料在氧化铝陶瓷基底上的高温润湿行为和界面结合性能,分析了温度、气氛和压力对组织和性能的影响规律.研究结果表明:真空条件下580℃熔融玻璃焊料与陶瓷基底之间接触角最小,为15.54°,玻璃焊料与氧化铝陶瓷基底具有良好的润湿性;在580℃真空条件下,且无加压烧结时,粘接试样中玻璃焊料与氧化铝陶瓷基底粘接强度最大,达到36.38 MPa;从微观结构分析,玻璃焊料与陶瓷基底在580℃真空条件下烧结后,焊料内部无明显气泡产生,且与陶瓷基底界面结合良好.Borosilicate glass was used as solder,and alumina ceramic sheets were used as substrate.The high-temperature wetting behavior and interfacial bonding properties of glass solder on alumina ceramic substrates were investigated,and the effects of temperature,atmosphere and pressure on the microstructure and properties were analyzed.The results show that the minimum contact angle between 580℃molten glass solder and ceramic substrate under vacuum is 15.54°,and the glass solder and the alumina ceramic substrate have good wettability.Sintered under no pressure at 580℃,the bonding strength is the highest with value of 36.38 MPa.According to the microstructure analysis,when the glass solder and the substrates are sintered under vacuum at 580℃,there are no obvious bubbles inside the glass solder with good interface combination to ceramic substrate.

关 键 词：玻璃焊料 氧化铝陶瓷 烧结工艺 接触角 微观形貌 

分 类 号：TB321[一般工业技术—材料科学与工程]