小线径键合金丝熔断电流测试与分析  

Test and Analysis of the DC Fusing Current of Small Gold Wire

作　　者：伍艺龙[1] 罗建强[1] 丁义超 陈绪波 李亚茹 季兴桥[1] 康菲菲 周文艳 WU Yi-long;LUO Jian-qiang;DING Yi-chao;CHEN Xu-bo;LI Ya-ru;JI Xing-qiao;KANG Fei-fei;ZHOU Wen-yan(The 29^(th) Research Institute of China Electronics Technology Group Corporation,Chengdu 610036,China;Sino-Platinum Metals CO.,LTD,Kunming 650156,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036 [2]贵研铂业股份有限公司,云南昆明650156

出　　处：《中国电子科学研究院学报》2021年第5期430-433,450,共5页Journal of China Academy of Electronics and Information Technology

摘　　要：键合引线的电流承载能力是封装设计的重要考虑因素之一,如果设计不当会导致引线熔断失效。目前小线径键合金丝在高集成度、多I/O、高频率封装中的应用越来越多,但对小线径金丝熔断特性的研究较少。文中分析了熔断电流理论计算的局限性,设计了熔断电流测试样件及测试软件,对小线径金丝的熔断电流进行了测试,并给出了安全设计电流建议。The current-carrying capacity of bonding wires is an important packaging design parameter.If designed improperly,failure phenomenon would occur such as wire burnout.The small diameter gold bonding wires are commonly used currently for high density,multi I/O,high frequency packaging.However,there’s little experimental data on small diameter wire fusing current.In this paper,the limitation of fusing current calculated equation was analyzed.A test specimen and test program was designed.The fusing current of several small diameter gold wires were tested and some design tips were proposed.

关 键 词：小线径 键合金丝 熔断电流 

分 类 号：TN454[电子电信—微电子学与固体电子学]