热循环对金带微电阻点焊接头连接界面及抗拉力的影响  

The Effect of Thermal Cycle on The Joint Interface and Tensile Force of Gold Strip Micro-Resistance Spot Welding Joints

作　　者：蒋玲玲 郭芮岐 刘刚[1] 张乐 樊凯 张勇[1] JIANG Ling-ling;GUO Rui-qi;LIU Gang;ZHANG Le;FAN Kai;ZHANG Yong(Shaanxi Key Laboratory of Friction Welding Engineering Technology,Northwestern Polytechnical University,Xi'an 710072,China;Xi'an Branch,China Academy of Space Technology,Xi'an 710100,China)

机构地区：[1]西北工业大学陕西省摩擦焊接工程技术重点实验室,西安710072 [2]中国空间技术研究院西安分院,西安710100

出　　处：《强度与环境》2021年第3期53-58,共6页Structure & Environment Engineering

摘　　要：针对金带/陶瓷基板镀金层组合互连结构,制备单面微电阻点焊焊点,在模拟空间环境温度交替变化的条件下,即-65℃~150℃,温度转换时间<1分钟,高低温保温时间各15分钟,进行500次的热循环试验。借助聚焦离子/电子双束电镜和拉力测试机,研究焊点的微观界面、断裂模式及抗拉力,分析有无热循环焊点连接界面变化机理及焊点的可靠性。结果表明,热循环过程中,焊点连接界面上未紧密接触的孔洞,在畸变能差驱动的界面扩散作用下,从孔颈处开始接触并发生原子结合,尺度减小。未经热循环焊点和经历了热循环试验的焊点,断裂模式均为金带颈部断裂,平均拉力值变化不超过10g,其差异主要由热循环试验热应力对金带的损伤程度不同引起。在模拟空间环境热循环试验条件下,金带/陶瓷基板镀金层组合互连结构单面微电阻点焊焊点具备高可靠度。According to the interconnection structure of gold strip/ceramic substrate gold-plated layer,single-sided micro-resistance spot welding solder joints are prepared,under the simulated space environment conditions of-65℃~150℃,temperature conversion time<1 minute,high and low temperature holding time each 15 minutes,performing 500 thermal cycle tests.With the help of a focused ion/electron dual-beam electron microscope and a tensile tester,the micro-interface,fracture mode and tensile force of the solder joints are studied,and the mechanism of changes in the joint interface of the solder joints with or without thermal cycle and the reliability of the solder joints are analyzed.The results show that during the thermal cycle process,the holes in the solder joint interface that are not in close contact,under the interface diffusion mechanism driven by the distortion energy difference,start to contact and bond with atoms from the hole neck,and the size decreases.For solder joints that have not been thermally cycled and those that have undergone thermal cycle tests,the fracture modes are all gold strip neck fractures,and the average tensile force does not change more than 10g.The difference is mainly caused by the different degree of damage to the gold strip caused by the thermal stress of the thermal cycle test.Under the conditions of the thermal cycle test of the simulated space environment,the single-sided micro-resistance spot welding joints of the gold strip/ceramic substrate gold-plated layer interconnect structure are reliable.

关 键 词：金带 微电阻点焊 热循环 连接界面 可靠性 

分 类 号：TG407[金属学及工艺—焊接]