低温活性钎焊Mo接头组织及力学性能研究  

Study on Microstructure and Mechanical Properties of Mo Joint by Active Soldering at Low Temperature

作　　者：李润林[1] 郭卫兵 LI Runlin;GUO Weibing(No.724 Research Institute of CSIC,Nanjing 210003,China;School of Materials Science and Engineering,Hebei University of Technology,Tianjin 300401,China)

机构地区：[1]中国船舶重工集团公司第七二四研究所,江苏南京210003 [2]河北工业大学材料科学与工程学院,天津300401

出　　处：《热加工工艺》2021年第13期54-58,共5页Hot Working Technology

基　　金：河北省自然科学基金项目(E2019202407)。

摘　　要：为了解决太空飞行器用太阳能电池Mo互连片表面Ag镀层因原子氧侵蚀寿命低的问题,采用低温Sn基钎料,通过添加活性元素Ti和施加超声的复合活化方法,在大气环境、300℃、无钎剂的条件下直接钎焊了纯Mo。重点研究了焊后不同保温温度对超声波钎焊Mo接头微观组织、界面处元素分布以及接头力学性能的影响。结果表明,随保温温度的升高,界面处Sn_(3)Ti_(2)相明显增加,过渡层明显变厚,剪切强度也随之提高。当钎焊温度600℃时,接头的剪切强度达到最大值22.78 MPa,接头完全断裂在钎缝中。In order to solve the problem of low life of Ag coating on the surface of Mo interconnects for spacecraft solar cells due to the atomic oxygen erosion, the low-temperature Sn-based solder with active element Ti was used to solder pure Mo by activation of ultrasonic vibration in the atmospheric environment at 300℃ and without flux. The effects of different holding temperature on the microstructure, element distribution in the interface and mechanical properties of the joints were studied. The results show that with the increase of holding temperature, the Sn_(3)Ti_(2) phase at the interface increases obviously, the transition layer thickens obviously, and the shear strength also increases. When the holding temperature is 600 ℃, the shear strength of the joint reaches the maximum value of 22.78 MPa, and the joint fractures inside the brazing seam.

关 键 词：钼 超声波钎焊 Ti活化 组织 力学性能 

分 类 号：TG454[金属学及工艺—焊接]