Solder paste metamorphism  

作　　者：Fu-Wen Zhang Hui-Jun He Zhi-Gang Wang Gang Lin Jie Zhu Jiang-Song Zhang Shao-Ming Zhang 

机构地区：[1]General Research Institute for Nonferrous Metals,Beijing 100088,China [2]Beijing COMPO Advanced Technology Co.Ltd,Beijing 101407,China

出　　处：《Rare Metals》2021年第5期1329-1336,共8页稀有金属（英文版）

基　　金：financially supported by National Key R&D Program of China(No.2017YFB0305700)。

摘　　要：Solder paste quality can be improved from microstructure and surface status of the solder powder.In this work,the micro-morphology of solder paste was observed and the particle surface condition was analyzed.Also,the conditions of corrosion and the corrosion products in different organic acid groups(activators)were analyzed.The result shows that the SnO passive film on the solder powder surface reacts with the COO-in the active agent of the solder paste.This reaction led the passivation layer to be peeled off.It also caused the change in solder powders’physical and chemical properties and made the metal boundary to be cold-welded.This is the root cause of solder paste exsiccation and deterioration.The study on the details shows that to obtain high-quality solder paste,one of the key methods is using the solder powder with ideal passivation shell structure and defect-free surface.

关 键 词：Solder powder MICRO-MORPHOLOGY Metamorphic solder paste Surface corrosion 

分 类 号：TG42[金属学及工艺—焊接]