元器件结构分析方法研究  

Research on component structure analysis method

作　　者：谭士海 冯慧 范士海 Tan Shihai;Feng Hui;fan Shihai(Aerospace Science and engineering defense technology research and test center,Beijing,100085)

机构地区：[1]航天科工防御技术研究试验中心,北京100085

出　　处：《电子测试》2021年第15期97-100,共4页Electronic Test

摘　　要：元器件作为组成板卡级、整机级的基本单元,对于装备的质量与可靠性而言,元器件的可靠性至关重要。目前,元器件结构分析技术能够有效发现元器件中结构缺陷、设计缺陷和材料选用缺陷,是促进元器件可靠性的重要手段,是新型元器件应用的有效验证技术,也是提高装备可靠性的必要手段。元器件结构分析能够有效的为用户提供国内外器件的设计对比情况,为用户选用提供技术支持;通过元器件环境适应性的评估等环节,能够帮助元器件制造厂商进行设计、工艺等改进,提高国产元器件的质量等级。然而结构分析技术的关键在于在综合考量方案制定与应用环境的关系基础上,分析应用环境的影响逐级分解元器件至最小结构单元,通过评价应用环境对各结构单元的影响,给出适用性结论并提出合理化改进建议。As the elementary unit of board level and device level,the reliability of electron components is significant for the quality and reliability of missile model.Under the localization,structure analysis technique of electronic components can effectively find the structural defects,design defects and material defects in the electronic components.It is an important means to promote localization replacement of electronic components,an effective verification technology for the new electronic component model,and a necessary means to improve missile model reliability.Structure analysis of electronic components can effectively provide users with the design comparison of domestic and foreign components,and provide technical support for users to chose.It can help manufactures to improve design and quality level of electronic components by evaluating the adaptability of the missile environment.However,the key of structure analysis technique lies in the relationship between the structure analysis method and the missile environment.Analyzing the impact of missile environment,electronic components are decomposed step by step to the minimum unit.Finally,by evaluating the impact of the missile environment on each unit,applicability conclusions are given and reasonable improvement suggestions are put forward.

关 键 词：元部件 结构分析 可靠性 

分 类 号：TN60[电子电信—电路与系统]