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作 者:姜文政 林瑛 江平开[1] 黄兴溢[1] JIANG Wenzheng;LIN Ying;JIANG Pingkai;HUANG Xingyi(Shanghai Key Laboratory of Electrical Insulation and Thermal Ageing,Shanghai Jiao Tong University,Shanghai 200240)
机构地区:[1]上海交通大学上海市电气绝缘和热氧老化重点实验室,上海200240
出 处:《电气工程学报》2021年第2期12-24,共13页Journal of Electrical Engineering
基 金:国家自然科学基金资助项目(51877132)。
摘 要:在聚合物基导热复合材料中,构筑三维填料网络结构因能够为复合材料提供导热通路、降低界面热阻而受到广泛关注,综述了具有三维氮化硼导热网络结构的聚合物复合材料的研究进展。介绍了氮化硼的本征导热性质和氮化硼填料的改性方法。详细介绍了三维氮化硼导热网络的构建方法,包括杂化填料构建三维导热网络、模板法、自组装法、静电纺丝法及模压法等。介绍了导热三维氮化硼聚合物纳米复合材料的应用以及目前存在的问题和展望。Among polymer-based thermally conductive composites,composites with a three-dimensional thermally conductive network structure can provide unobstructed thermal conduction paths and significantly reduce interface thermal resistance,which has attracted widespread attention.The research progress of polymer composites with a three-dimensional thermally conductive network structure using boron nitride as a thermally conductive filler is reviewed.Firstly,the intrinsic thermal conductivity of boron nitride and the method of modifying the boron nitride filler are introduced.Secondly,the construction methods of three-dimensional boron nitride thermal network in detail is introduced,including hybrid fillers to construct three-dimensional thermal network,template method,self-assembly method,electrospinning method and molding method.Finally,the potential applications of the three-dimensional nano-boron nitride thermal conductive material are proposed,its current problems and the development trend of this material are introduced.
分 类 号:TM21[一般工业技术—材料科学与工程]
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