移除SMP端面夹具效应测试技术研究  

Study on Testing Technology of Removing Fixture Effect on SMP Interface

作　　者：金成 楼红英 沈保龙 Jin Cheng;Lou Hongying;Shen Baolong(The 14^(th)Research Institute of China Electronics Technology Group Corporation,Nanjing 210039)

机构地区：[1]中国电子科技集团公司第十四研究所,南京市210039

出　　处：《仪器仪表标准化与计量》2021年第3期34-37,共4页Instrument Standardization & Metrology

摘　　要：本文研究测试微波器件时去除夹具效应的难题,介绍使用矢量网络分析仪的端口延伸和去嵌入两种技术进行移除夹具效应的具体过程和优缺点,并对去嵌入技术的原理进行详细的理论分析。利用本实验室设计的传递标准件和配套的夹具进行实验,使用5种不同的SMP端面测试方法测试同一SMP微波器件S参数,比较5种方法移除夹具效应的能力。通过对实验结果的分析可以得出结论,相较于其他4种方法,去嵌入的方法能够更为有效地去除夹具效应,实现SMP端面的准确测试。The paper studies the difficult problem of removing the fixture effect when testing microwave devices,introduces the specific process of using port extension and de-embedding techniques of vector network analyzer to remove the fixture effect,analyzes the advantages and disadvantages of two methods,and carries on a detailed theoretical analysis of the principle of the de-embedding technology.The transfer standard designed by the laboratory and the matching fixture were used for the experiment.Five different methods of testing on SMP interface were used to test the S parameters of the same SMP microwave device,and then compared the ability to remove the fixture effect of the five methods.Through the analysis of the experimental results,it can be concluded that,compared with the other four methods,the method of de-embedding can remove the fixture effect more effectively and realize the accurate test of SMP interface.

关 键 词：SMP校准 去嵌入 微波器件测试 

分 类 号：TN958.92[电子电信—信号与信息处理]