Sn/Cu互连界面化合物在固-液扩散条件下的生长  

Growth of Sn/Cu interconnect interface compounds under solid-liquid diffusion

作　　者：蔡珊珊 罗晓斌 彭巨擘 于智奇 周慧玲 吴绪磊 刘宁[2] 王小京[2] CAI Shan-shan;LUO Xiao-bin;PENG Ju-bo;YU Zhi-qi;ZHOU Hui-ling;WU Xu-lei;LIU Ning;WANG Xiao-jing(Yunnan Tin Group(Holding)Co.,Ltd.,Kunming 650000,Yunan pro.,China;Jiangsu University of Science and Technology,Zhenjiang 212003,Jiangsu pro.,China)

机构地区：[1]云南锡业集团(控股)有限责任公司,云南昆明650299 [2]江苏科技大学材料学院,江苏镇江212003

出　　处：《焊接技术》2021年第6期5-9,I0011,共6页Welding Technology

基　　金：云南省重大科技专项(202002AB080001-2)。

摘　　要：文中考察了Sn/Cu互连界面在固-液扩散过程中的界面反应动力学、热力学行为,考察了固-液反应时间、温度对Sn/Cu界面化合物的影响,分析了不同温度条件下(250,280,310℃)化合物的生长速率,并在该温度范围内计算了Sn/Cu界面化合物的生长激活能数据,得到界面化合物在固-液扩散条件下随时间的延长受制于扩散过程的结论。其激活能约为固态保温条件下激活能的一半,扩散系数则比固态时效的高约34个数量级。The kinetics and thermodynamics of Sn/Cu interface reaction during solid-liquid diffusion were investigated. The effects of holding time and temperature under solid-liquiddiffusion on the evolution of Sn/Cu interface compounds were observed. The growth rates of the compounds at different temperatures(250 ℃, 280 ℃ and 310 ℃) were analyzed. The activation energy data of the Sn/Cu interface compounds were calculated in this temperature range. It was found that the growth of the compounds with time was controlled by the diffusion process under the condition of solid-liquid diffusion. The activation energy was about half of that of solid aging, and the diffusion coefficient was about 3 ~ 4 orders of magnitude higher than that of solid aging.

关 键 词：Sn/Cu焊点 界面 化合物 固-液扩散 

分 类 号：TG454[金属学及工艺—焊接]