High-aspect-ratio nanoimprint process chains  

作　　者：Víctor J.Cadarso Nachiappan Chidambaram Loïc Jacot-Descombes Helmut Schift 

机构地区：[1]Laboratory for Micro-and Nanotechnology,Research Division Synchrotron Radiation and Nanotechnology,Paul Scherrer Institut,Villigen 5232,Switzerland [2]Micro Resist Technology GmbH,Köpenicker Straße 325,Berlin 12555,Germany

出　　处：《Microsystems & Nanoengineering》2017年第1期221-232,共12页微系统与纳米工程（英文）

基　　金：This work is partially funded by the Swiss National Science Foundation(SNF)Ambizione project(no.PZ00P2_142511)granted to VJC.

摘　　要：Different methods capable of developing complex structures and building elements with high-aspect-ratio nanostructures combined with microstructures,which are of interest in nanophotonics,are presented.As originals for subsequent replication steps,two families of masters were developed:(i)3.2μm deep,180 nm wide trenches were fabricated by silicon cryo-etching and(ii)9.8μm high,350 nm wide ridges were fabricated using 2-photon polymerization direct laser writing.Both emerging technologies enable the vertical smooth sidewalls needed for a successful imprint into thin layers of polymers with aspect ratios exceeding 15.Nanoridges with high aspect ratios of up to 28 and no residual layer were produced in Ormocers using the micromoulding into capillaries(MIMIC)process with subsequent ultraviolet-curing.This work presents and balances the different fabrication routes and the subsequent generation of working tools from masters with inverted tones and the combination of hard and soft materials.This provides these techniques with a proof of concept for their compatibility with high volume manufacturing of complex micro-and nanostructures.

关 键 词：cryo-etching direct 6 write laser lithography high aspect ratio MOULDING nanoimprint lithography ORMOCER photonic nanofences 2-photon polymerization 

分 类 号：TB3[一般工业技术—材料科学与工程]