聚合反应温度对聚酰亚胺基碳膜结构和性能的影响研究  

Effects of Polymerization Temperature on the Microstructure and Properties of PI-based Carbon Films

作　　者：陈子豪 蔡云飞 张腾飞 王启民[1] CHEN Zi-hao;CAI Yun-fei;ZHANG Teng-fei;WANG Qi-min(Department of Electro-mechanical Engineering,Guangdong University of Technology,Guangzhou 510006,China)

机构地区：[1]广东工业大学,机电工程学院,广东广州510006

出　　处：《化工管理》2021年第21期90-92,共3页Chemical Engineering Management

基　　金：装备预研领域基金项目(61409220407)。

摘　　要：人工石墨膜凭借其优异的导热性能,在电子元器件散热领域具有重要应用。文章通过调整聚合合成聚酰胺酸(PAA)溶液过程中的反应温度,制备石墨膜前驱体聚酰亚胺(PI)原膜,将不同工艺条件下制得的PI膜进行碳化、石墨化处理,得到高导热率石墨膜。利用扫描电镜、FTIR、拉曼光谱仪和LFA激光闪射仪对制备的PI膜、碳化膜及石墨膜的微观结构和热导率进行检测。结果表明,随聚合反应温度升高,PI膜酰亚胺化程度和石墨膜的石墨化程度及导热性能逐渐降低,反应温度为-15℃时制得的石墨膜结构致密,石墨片层取向性好,导热性能最好,热导率可达765.2 W/(m·K)。Artificial graphite film has an important application in the field of heat dissipation of electronic components due to its excellent thermal conductivity.In this paper,by adjusting the reaction temperature in the polymerization process of polyamic acid(PAA)solution,the polyimide(PI)original films were prepared,which were the precursor of graphite films.The PI films prepared under different process conditions were carbonized and graphitized to obtain high thermal conductivity graphite films.The microstructure and thermal conductivity of PI films,carbon films and graphite films were measured by SEM,FTIR,Raman spectroscopy and LFA laser flash analyzer.The results show that with the increase of polymerization temperature,the degree of amidation of PI films,the degree of graphitization and the thermal conductivity of graphite films decrease.When the reaction temperature is-15℃,the graphite film prepared has the most compact structure,good orientation of graphite sheet and the best thermal conductivity,with the thermal conductivity could reach to 765.2 W/(m·K).

关 键 词：聚酰亚胺 石墨膜 聚合反应温度 热导率 

分 类 号：O631.3[理学—高分子化学]