厚铜板阻焊制作流程优化研究  

Research on optimization of thick copper plate solder mask manufacturing process

作　　者：丁敏达 廉泽阳 李艳国 黄振伦 Ding Minda;Lian Zeyang;Li Yanguo;Huang Zhenlun

机构地区：[1]泰和电路科技(惠州)有限公司研发中心,广东惠州516006 [2]泰和电路科技(惠州)有限公司,广东惠州516006

出　　处：《印制电路信息》2021年第7期28-32,共5页Printed Circuit Information

摘　　要：厚铜印制电路板的应用在增多,但是厚铜板在阻焊制作过程中存在许多难点和痛点,其阻焊制作流程冗长,工序成本骤增、产出减半、过程中易出现油薄、擦花等品质异常。本文基于油墨特性及阻焊流程分析,通过油墨预烤、感光性能及丝印网版目数的改善,采用油厚、堤位侧蚀、显影性进行探究,最终输出了厚铜板阻焊制作方案,同时,生产效率提升约40%,成本降低约20%。PCB thick copper plate has a wide range of applications.There are difficulties and pain points in the resistance welding process of thick copper plate.The resistance welding process is lengthy,the process cost increases sharply,the output is reduced by half,and the process is prone to oil thin,scratch and other quality abnormalities.Based on the analysis of ink characteristics and solder mask process,through the improvement of ink pre-baking,photosensitivity and screen mesh number,this paper explores the oil thickness,bridge side corrosion and development,and finally outputs the solder mask production scheme of thick copper plate.At the same time,the production efficiency is improved by about 40%,and the cost is reduced by about 20%.

关 键 词：厚铜板 阻焊丝印 阻焊预烤 阻焊曝光 阻焊显影 

分 类 号：TN41[电子电信—微电子学与固体电子学]