宇航用三维PoP存储器模块功能异常分析及改进  

Functional Failure Analysis and Improvement of 3D PoP Memory Module for Aerospace

作　　者：顾毅欣 王超 余欢[1] 张丁[1] 陈慧贤 GU Yixin;WANG Chao;YU Huan;ZHANG Ding;CHEN Huixian(Xi’an Microelectronics Tecnology Institute,Xi’an 710119,China)

机构地区：[1]西安微电子技术研究所,陕西西安710119

出　　处：《电子工艺技术》2021年第4期214-219,共6页Electronics Process Technology

摘　　要：针对近年来在星用固存上广泛使用的三维PoP(Package on Package)存储器的各种失效模式,结合宇航用电子元器件考核要求严苛、应用环境复杂等特点,从组装制造工艺缺陷、安装使用过程中方法不当等方面进行分析,论述可能导致的模块故障模式。从产生机理进行研究,分析了模块制造过程中的灌封工艺、表面金属化工艺等对最终产品可靠性的影响,并提出改进优化措施。针对模块易吸潮和对高温敏感的特性也给出了安装的建议,提出了一种通过施加元器件外部涂覆层来实现有效防护的方法。Aiming at various failure cases and phenomena in the application of 3D PoP(Package on Package)memory module widely used in spaceborne solid state storage system in recent years,and combined with the strict requirements and complex application environment of electronic components for aerospace,the possible fault modes of module is analyzed from three aspects,which involved the assembly and manufacturing defects,improper installation and use.Moreover,the generation mechanism is studied.The infl uence of encapsulating and surface metallization process on the reliability of the product is analyzed,and the improvement measures are proposed.In consideration of the characteristics of moisture absorption and high temperature sensitivity,the installation suggestions are also given,and an effective protection method is proposed by applying the conformal coating of the component.

关 键 词：三维PoP封装 故障模式 失效 机理研究 

分 类 号：TN605[电子电信—电路与系统]