航天器大尺寸阵列封装FPGA器件的落焊工艺  

Soldering Process of Large-size Array Packaging FPGA Devices for Spacecraft

作　　者：来林芳 雷素玲 常春兰 沈丰 李晴 LAI Linfang;LEI Suling;CHANG Chunlan;SHEN Feng;LI Qing(Beijing Institute of Space Mechanics&Electricity,Beijing 100190,China)

机构地区：[1]北京空间机电研究所,北京100190

出　　处：《电子工艺技术》2021年第4期228-231,共4页Electronics Process Technology

摘　　要：针对航天器电子产品上大规模阵列封装FPGA器件三防固封后落焊的特点,分析了三防漆与硅橡胶对FPGA器件落焊的影响,重点对返修工作站拆卸和焊接元器件时印制板组件的热分布情况进行了研究。结合实际工作经验,通过大量的试验总结了三防固封后大规模阵列封装FPGA器件落焊的具体工艺流程与实施方法,验证了方法的有效性。According to the characteristics of FPGA devices in large-size array packaging on spacecraft electronic products,the infl uence of three-proofi ng conformal coating and silicone rubber adhesive staking on the soldering process of FPGA devices is analyzed.It is focused on the heat distribution of the printed circuit board assembly when the FPGA devices are removed and then soldered using the rework station.Combined with practical work experience and a large number of experiments,the specifi c soldering process of large-size array packaging FPGA devices after three-proofing conformal coating and silicone rubber adhesive staking is summarized,which is proved to be effective.

关 键 词：FPGA 落焊 阵列封装器件 返修 三防固封 

分 类 号：TN605[电子电信—电路与系统]