片式电感叠片机的叠片精度控制技术  

Precision Control Technology of Chip Inductor Laminating Machine

作　　者：刘肖斌 马良 LIU Xiaobin;MA Liang(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工艺技术》2021年第4期236-239,共4页Electronics Process Technology

摘　　要：叠片机是片式电感生产过程中的关键设备,在LTCC、HTCC、MLCC、氧传感器、陶瓷基座、晶振等领域均有广泛的应用。叠片精度的高低影响着层与层之间线路的互联和导通,是片式电感一体成型的关键。目前叠片工艺中主要使用国外厂商的生产设备,国内还没有非常成熟的工艺设备。旨在通过对多层陶瓷叠片工艺的了解,探究国内叠片工艺设备的发展方向。Laminating machine is the key equipment in the production of chip inductor,and it is widely used in LTCC,HTCC,MLCC,oxygen sensor,ceramic base,crystal vibration and other fi elds.The precision of lamination affects the interconnection and conduction of the lines between layers and is the key to the integrated molding of chip inductors.At present,the lamination process mainly uses the production equipment of foreign manufacturers,and there is no very mature process equipment in China.The purpose is to explore the development direction of domestic laminating equipment through the understanding of multilayer ceramic laminating process.

关 键 词：片式电感 叠片 叠片精度 视觉对位 

分 类 号：TN605[电子电信—电路与系统]