基于主动分流的功放芯片阵列的热管理设计  

Thermal Management Design of Power Amplification Array Basedon Active Flow Distribution

作　　者：廖长江[1] 冷国俊[1] 尹本浩[1] LIAO Changjiang;LENG Guojun;YIN Benhao(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子机械工程》2021年第4期13-16,共4页Electro-Mechanical Engineering

摘　　要：在功放T/R组件阵列化应用需求下,如何分配冷却液,使T/R组件获得良好的均温性是一个迫切需要解决的问题。文中通过仿真和试验设计了一种基于主动分流的功放组件阵列热管理系统。每个阵列单元嵌入一个微型阀,通过温度反馈和比例-积分-微分(Proportion-Integral-Differential,PID)算法来主动控制冷却液流量。试验结果表明,该方案能较好地实现冷却液在末端热沉的按需分配,使得阵列温度分布的一致性较好。Due to array application requirement of power amplification T/R module,how to allocate cooling resources so that temperatures of these T/R modules can uniformly distributed is an urgent problem to be solved.In this paper a thermal management system of the power amplification T/R module arrays based on active flow distribution is studied by thermal simulation and experiment.Each array is embedded in a miniature valve to control the cooling resources by temperature feedback and PID(Proportion-IntegralDifferential)algorithm.The results indicate that this thermal management system can enable the cooling resources to be distributed according to requirement so that the temperature distribution of the arrays is uniform.

关 键 词：热管理 主动分流 温度分布 

分 类 号：TK414.2[动力工程及工程热物理—动力机械及工程]