一种开放式风冷机箱内部器件温度评估方法  

An Evaluation Method of Internal Component Temperature in Open Air-cooled Cabinet

作　　者：刘冠宏[1] LIU Guanhong(The 20th Research Institute of CETC,Xi’an 710068,China)

机构地区：[1]中国电子科技集团公司第二十研究所,陕西西安710068

出　　处：《电子机械工程》2021年第4期21-25,29,共6页Electro-Mechanical Engineering

摘　　要：为了简单地估算在高温环境中工作时设备内部的电子器件温度以判断其结构设计是否合理,也为了将复杂的系统要求转化为各个分机或零件的要求,以减少冗余及重复性的设计,文中以开放式风冷机箱为例,提出了一种通过等效热阻模型计算器件温度的方法,并通过Flotherm热仿真软件对其进行了验证。该方法计算简单,可根据系统要求及系统的热阻网络模型提出分机要求,以适应多厂家的协同研发。验证结果表明,该方法可用于器件温度的估算,可以指导热设计。The electronic equipment should meet the strict requirements of working in high temperature environment.In order to simply estimate the temperatures of electronic components in the equipment when working at high temperature to judge whether its structural design is reasonable and to transform the complex system requirements into the requirements of each unit or part,so as to reduce the redundancy and repetitive design,a method to calculate the component temperature through the equivalent thermal resistance model is put forward and verified by Flotherm thermal simulation software in this paper,taking the open air-cooled cabinet as an example.This method is simple to calculate and can put forward the extension requirements according to the system requirements and the thermal resistance model of the system,so as to adapt to the collaborative research and development of multiple manufacturers.The results show that this method can be used to estimate the component temperature and can guide the thermal design.

关 键 词：等效热阻 开放式风冷机箱 器件温度 热设计 

分 类 号：V243[航空宇航科学与技术—飞行器设计]