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作 者:WU Li-Juan ZHANG Wen-Tong ZHANG Bo LI Zhao-Ji 吴丽娟;章文通;张波;李肇基(College of Communication Engineering,Chengdu University of Information Technology,Chengdu 610225;State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 610054)
机构地区:[1]College of Communication Engineering,Chengdu University of Information Technology,Chengdu 610225 [2]State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 610054
出 处:《Chinese Physics Letters》2013年第12期112-115,共4页中国物理快报(英文版)
基 金:Supported by the National Natural Science Foundation of China(No 61306094);the Project of Sichuan Provincial Educa-tion Department(No 13ZA0089);the Research Fund for the Middle and Youth Academic Leader of Chengdu University of Information Technology(No J201301).
摘 要:A novel silicon-on-insulator(SOI)high-voltage device of super-junction(SJ)lateral-double-diffused metal-oxide-semiconductor transistors(LDMOSTs)with T-dual dielectric buried layers(T-DBLs)is presented.The T-DBLs are formed by the first T-shaped dielectric layer and the second dielectric layer.A lot of holes are accumulated on the top interface of the second dielectric layer,which compensates for the charge imbalance of the surface N and P pillars,thus the substrate-assisted depletion(SAD)effect is eliminated in the new device.The electric field of the second dielectric buried layer,EI2,is enhanced by the interface charges,and the breakdown voltage Vbreakdown is increased.EI2=515 V/μm is obtained in the T-DBL SOI SJ.The Vbreakdown of the new device is increased from 124 V of the conventional SOI SJ to 302 V with a 15μm length drift region.The specific on-resistance(Ron,sp)of the T-DBL SOI SJ is only 0.00865Ω?cm2 and the FOM(FOM=V2breakdown/Ron,sp)is 10.54 MW/cm2.
关 键 词:BREAKDOWN SOI DIELECTRIC
分 类 号:TN3[电子电信—物理电子学]
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