列车MPU高速芯片散热设计及仿真研究  

Design and simulation research on the heat dissipation of train MPU high-speed chip

作　　者：丁馨楠 DING Xinnan(CRRC Dalian R&D Co.,Ltd.,Dalian 116052,China)

机构地区：[1]中车大连电力牵引研发中心有限公司,辽宁大连116052

出　　处：《铁道机车与动车》2021年第7期18-20,I0003,共3页Railway Locomotive and Motor Car

摘　　要：热仿真用作电子产品的散热设计,对在不同环境、不同功率下的电子产品温度进行可靠预测,从而进行散热设计,预防高温失效。针对列车MPU高速处理器芯片的结构进行散热仿真研究,并对比仿真结果与实际测试结果,进而进行优化,达到了使用仿真进行散热设计的目的。Thermal simulation used for the thermal design of electronic products reliably predict the temperature of electronic products under different environments and different powers,so as to conduct thermal design and prevent high-temperature failure. According to the structure of the train MPU high-speed processor chip,the heat dissipation simulation research is carried out,and the simulation results are compared with the actual prediction results,by which the design is optimized,achieving the purpose of simulation.

关 键 词：散热设计 处理器芯片 仿真建模 

分 类 号：TN305.94[电子电信—物理电子学] U260[机械工程—车辆工程]