基于信号与电源完整性的有效分析优化2.5D-3D的设计  

Optimizing 2.5D/3D IC design with efficient power and signal integrity analysis

作　　者：何永松 秦祖立 林麟 吴凯 He Yongsong;Qin Zuli;Lin Lin;Wu Kai(Shanghai Enflame Technology,Shanghai 200000,China;Cadence Shanghai,Shanghai 200000,China)

机构地区：[1]上海燧原科技有限公司,上海200000 [2]上海铿腾电子科技有限公司,上海200000

出　　处：《电子技术应用》2021年第8期64-67,71,共5页Application of Electronic Technique

摘　　要：HBM(高带宽内存)存储系统与传统的DRAM接口相比,具有高速率和低功耗特性。在2.5D/3D的设计中,随着HBM速率的提高,对信号与电源完整性的设计的考量越来越重要,如何通过有效的仿真指导产品的设计是一个挑战。首先从信号完整性的角度讨论了设计的考量点,其次从电源完整性的角度讨论电源噪声在高速传输信号中的影响,并提出了如何仿真与预测大量同步开关噪声等电源噪声对眼图的影响,最后基于芯片的测试结果对比仿真,给出结论。Compared with the traditional DRAM interface,the HBM(High Bandwidth Memory)storage system has the characteristics of high speed and low power consumption.In the design of 2.5D/3D,as the rate of HBM increases,the design considerations of signal and power integrity are becoming more and more important.How to guide the design of products through effective simulation is a challenge.The article firstly discusses design considerations from the perspective of signal integrity,then discusses the impact of power supply noise on high-speed transmission signals from the perspective of power integrity and proposes how to simulate and predict the effects of Simultaneous Switch noises.Finally based on the silicon chip,simulations have well correlated and verified by test results.

关 键 词：2.5D/3D设计 信号完整性 电源完整性 同步开关噪声 电源噪声预测 

分 类 号：TN402[电子电信—微电子学与固体电子学]