片上集成多维光互连和光处理  

On-Chip Integrated Multi-Dimensional Optical Interconnects and Optical Processing

作　　者：王健 曹晓平 张新亮 Wang Jian;Cao Xiaoping;Zhang Xinliang(Wuhan National Laboratory for Optoelectronics,Huazhong University of Science and Technology,Wuhan,Hubei 430074,China)

机构地区：[1]华中科技大学武汉光电国家研究中心,湖北武汉430074

出　　处：《中国激光》2021年第12期193-222,共30页Chinese Journal of Lasers

基　　金：国家重点研发计划(2019YFB2203604)。

摘　　要：随着云计算和数据中心的高速发展,片上集成光互连和光处理凭借在集成度、速度、带宽及功耗等方面的独特优势,成为突破传统电子瓶颈的关键技术。同时,光子具有频率、偏振、时间、复振幅及空间结构等多个物理维度,可发展为多维混合复用技术,进一步提升光互连和光处理的带宽。结合光场多个物理维度资源,分别对片上集成多维光互连和光处理的关键技术进行了回顾,并对其未来发展趋势进行总结和展望。Significance In the past half century,integrated circuits(ICs)supported by complementary metal-oxide semiconductor(CMOS)technology have developed rapidly,which promotes the continuous progress of modern information technology.As the feature size of transistors continues to decrease,the semiconductor-manufacturing process is gradually approaching its limit,resulting in slow or even stagnant improvement of integration.Meanwhile,the system performance is seriously restricted,mainly due to the electronic bottleneck.In addition,with the increase in the number of microprocessors and computing speed,power consumption and heat dissipation due to parasitic effects are becoming the main limiting factors.To break through the bottleneck of conventional IC technology in the post-Moore era,optical interconnects are considered to gradually replace conventional electrical interconnects.Compared with electrical signals,using light as the carrier for signal transmission has its unique advantages,such as large bandwidth,low loss,strong anti-electromagnetic interference capability,and high-speed parallel transmission without crosstalk.Therefore,optical interconnects will undoubtedly become the enabling technology for high-speed data transfer.Concurrently,at the network nodes,conventional optical-electrical-optical signal processing is still limited by the electronic bottleneck.Processing signals in the optical domain offer an effective strategy to increase speed.Consequently,on-chip optical interconnects and processing are paramount to the development of modern high-speed and large-capacity communication networks.The photonic integrated circuit(PIC)is paramount to realize on-chip optical interconnects and processing,which achieves rapid development in recent years.Silicon and III-V are both promising materials for the PIC platform.The main advantage of InP and other III-V materials is that they are direct bandgap materials,which can be used to fabricate semiconductor lasers,amplifiers,modulators,detectors,and other active devices.Ho

关 键 词：光电子学 光子集成 物理维度 多维复用 光互连 光处理 

分 类 号：O436[机械工程—光学工程]