Imaging and Characteristics of a Bimaterial Microcantilever FPA Fabricated using Bulk Silicon Processes  

作　　者：ZHAO An-Di ZHENG Yong-Jun YU Xiao-Mei 赵安迪;郑永军;于晓梅(School of Electronic and Information Engineering,Beijing Institute of Technology,Beijing 100081;National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Institute of Microelectronics,Peking University,Beijing 100871)

机构地区：[1]School of Electronic and Information Engineering,Beijing Institute of Technology,Beijing 100081 [2]National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Institute of Microelectronics,Peking University,Beijing 100871

出　　处：《Chinese Physics Letters》2012年第5期240-243,共4页中国物理快报（英文版）

基　　金：Supported by the National Natural Science Foundation of China under Grant Nos 90923028,60911130236 and 61036006;Hitech Research and Development Program of China under Grant No 2009AA04Z316.

摘　　要：For a focal plane array (FPA ) fabricated with a surface sacrificial layer process,the IR flux must transmit through the silicon substrate and the air gap before it reaches the cantilever pixels.Part of the IR radiation energy is therefore lost owing to the reflection and absorption caused by the silicon substrate.We fabricate an infrared FPA consisting of 128 × 128 microcantilever pixels by using a novel bulk micro-electro-mechanical-system process.Thermal images of persons at room temperature are captured to demonstrate the IR imaging capability of the FPA.For the proposed device,the thermal response is calculated to be 4.03 × 10^(-3),the thermo-mechanical sensitivity is measured to be 0.273μm/K,the noise equivalent temperature difference is measured to be 200mK by a gray level change method and the time constant is calculated to be 15ns under a 10mTorr pressure.

关 键 词：CANTILEVER BULK noise 

分 类 号：TN3[电子电信—物理电子学]