电真空器件中陶瓷-金属封接应力分析  

Stress Analysis of Ceramic-Metal Sealing in Vacuum Electronic Devices

作　　者：徐树森 向兵[1] XU Shu-sen;XIANG Bing(Beijing Vacuum Electronics Research Institute,Beijing 100015,China)

机构地区：[1]北京真空电子技术研究所,北京100015

出　　处：《真空电子技术》2021年第4期72-76,共5页Vacuum Electronics

摘　　要：本文针对电真空器件中常采用的平封、夹封、套封以及针封四种陶瓷-金属封接结构进行了热力学仿真分析,得到了不同封接结构的热应力分布情况,归纳了四种结构的封接特点,对某些封接工艺提出了一些有效的工艺实现方法,给出了陶瓷-金属封接设计中应注意的问题。Four kinds of ceramic-metal sealing structure commonly used in vacuum electronic devices including flat sealing,clip sealing,sleeve sealing and needle sealing are thermodynamically analyzed.Thermal stress distributions are obtained and the sealing characteristics are summarized.Several effective realization methods for sealing processes are put forward,and problems should be paid attention to in ceramic-metal sealing are summarized.

关 键 词：陶瓷 金属 封接 应力分析 

分 类 号：TB756[一般工业技术—真空技术]