基于半导体器件钎焊技术的温度场研究  

Finite Elements Analysis and Optimal Design for the Temperature Field of Vacuum Brazing Furnace

作　　者：解永强 靳丽岩 杨晓东 王成君 夏丹[2] 苏春[2] XIE Yong-qiang;JIN Li-yan;YANG Xiao-dong;WANG Cheng-jun;XIA Dan;SU Chun(The 2th Research Institute of CETC,Taiyuan 030024,China;School of Mechanical Engineering,Southeast University,Nanjing 211189,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024 [2]东南大学机械工程学院,江苏南京211189

出　　处：《真空》2021年第4期58-62,共5页Vacuum

摘　　要：随着半导体器件封装向小型化、高密度化、高可靠性的方向发展,半导体等行业对钎焊热场提出了高温度均匀性的要求。本文以半导体器件钎焊设备为研究对象,利用有限元仿真技术分析炉体内部温度场分布及其变化规律。文中分析温度场有限元分析的基本流程;以评估真空钎焊设备工作区温度分布均匀性为目标,根据工程实际数据完成真空钎焊设备有限元仿真建模,开展不同工况下温度场分布及其演变规律分析;通过与实测数据对比,验证模型以及仿真流程的准确性与可行性。研究结果表明,真空钎焊设备温度场分布符合设计要求。此外,仿真结果为此类设备的优化与改进提供了理论依据和有效手段。With the development of miniaturization,high density and high reliability of semiconductor device packaging,high temperature uniformity is required for brazing heat field in semiconductor industry. Selecting a type of vacuum brazing furnace as the research object,the technique of finite elements simulation is applied to analyze the distribution of temperature field as well as its change rule inside of the furnace. The basic procedure for carrying out finite elements analysis is introduced. With the aim to analyze the temperature uniformity,the finite elements simulation model is established based on practical engineering data,and the distribution of temperature field and its change process are obtained. By comparing with the test data,the effectiveness of the model and simulation procedure is verified. The results show that the distribution of the furnace temperature field meets the design requirement. Moreover,the corresponding simulation results also provide theoretical foundation and effective means for the optimization and improvement of such kinds of equipments.

关 键 词：真空钎焊 温度场均匀性 有限元分析 持续改进 

分 类 号：TH122[机械工程—机械设计及理论]