含铜玻璃对金属化银浆电极焊接性能的影响  

Effect of copper-contained glass on soldering property of metallized silver paste electrodes

作　　者：王坤 杨云霞[1] 袁晓[1] 李红波[1] 仝华[1] WANG Kun;YANG Yunxia;YUAN Xiao;LI Hongbo;TONG Hua(School of Materials Science and Engineering,East China University of Science and Technology,Shanghai 200237,China)

机构地区：[1]华东理工大学材料科学与工程学院,上海200237

出　　处：《电子元件与材料》2021年第8期741-746,共6页Electronic Components And Materials

基　　金：中央高校基本科研业务费专项资金项目(JKVJ12001039)

摘　　要：作为晶硅电池银浆的关键组成之一,玻璃在很大程度上决定了金属化银浆电极的焊接性能。从电极焊接强度、可焊性和耐焊性等方面,探讨了含铜PbO-B_(2)O_(3)-SiO_(2)玻璃对金属化银浆电极焊接性能的作用和影响。研究结果表明,银电极焊接强度与玻璃中铜含量以及焊接温度密切相关。当玻璃中铜含量较低时,银电极焊接强度随着铜含量的增加或者焊接温度的升高而增大。而玻璃中铜含量较高时(例如,玻璃原料中氧化铜与其他氧化物的摩尔比为5.4∶100),银电极焊接强度不再随着焊接温度的升高而增大,反而在400℃焊接温度下明显降低。电极可焊性和耐焊性的测试结果可以很好地解释这种变化。随着玻璃中铜含量的增加,银电极与焊料能够充分接触和反应生成金属间化合物Ag_(3)Sn,可焊性得到提升;同时,银电极的耐焊性却逐渐减弱。特别是在较高焊接温度下,焊料过度熔蚀银电极,破坏了银硅结合,使得焊接强度降低。因此,为使银电极具有最佳的焊接性能,需要优化玻璃中的铜含量。As one of the key components of silver(Ag)paste for crystalline silicon(c-Si)cells,the glass determines,to a great extent,the soldering performance of metallized Ag paste electrodes.Herein,the effect of copper-contained PbO-B_(2)O_(3)-SiO_(2)glass on the soldering performance of Ag paste electrodes was discussed,including the soldering strength,solderability and soldering endurance.The results show that the soldering strength of Ag electrodes is closely related to the content of copper(Cu)in glass and the soldering temperature.When the Cu content in glass is low,the soldering strength of Ag electrodes increases with Cu content or soldering temperature.However,when the Cu content in glass is too high(for example,the mole ratio of CuO to other oxides of raw glass material is 5.4∶100),the soldering strength of Ag electrodes no longer increases with the soldering temperature.In the contrary,it decreases significantly at 400℃.This change can be well explained by the test results of electrode solderability and soldering endurance.At higher Cu content in the glass,the solderability of Ag electrodes is improved,and the solder can fully contact and react with the Ag electrodes to form intermetallic compound Ag_(3)Sn.Meanwhile,the soldering endurance of Ag electrodes is gradually weakened.Especially at higher soldering temperature,the Ag electrode is eroded excessively by solder,which destroys the bonding between Ag and Si and reduces the soldering strength.Therefore,to make Ag electrodes with better soldering performance,it is necessary to optimize the Cu content in glass.

关 键 词：玻璃 银浆 电极 焊接 铜 

分 类 号：TM241.1[一般工业技术—材料科学与工程] TB31[电气工程—电工理论与新技术]