间位芳纶植入催化剂Ag预处理和无氨水镀浴化学镀银  

Pretreatment of meta-aramid by implanting catalyst Ag and electroless Ag plating in an ammonia-free bath

作　　者：薛小龙 张慧茹 XUE Xiaolong;ZHANG Huiru(Composite Materials Research Center,School of Materials Science and Engineering,Shanghai University,Shanghai 200444,China)

机构地区：[1]上海大学材料科学与工程学院,上海200444

出　　处：《电镀与涂饰》2021年第15期1173-1180,共8页Electroplating & Finishing

基　　金：国家自然科学基金(51103083)。

摘　　要：采用植入催化剂Ag预处理法对间位芳纶(PMIA)进行表面改性,并在无氨水的镀银浴中进行化学镀银。其中,植入催化剂Ag预处理法主要包括3个步骤:丙酮超声除油,硝酸银/二甲亚砜水溶液溶胀渗透植入,以及硼氢化钠还原。无氨水镀浴体系则是以乙二胺和乙二胺四乙酸二钠作为复合络合剂实现对氨水的替代。制得的试样表面银镀层光滑、平整且致密,具有良好的力学性能、热稳定性及导电性,方块电阻为20~30 mΩ/sq,且在30~3000 MHz频率范围内的电磁屏蔽效能为68.23 dB。The surface of meta-aramid(PMIA)was pretreated by implanting catalyst Ag,and then electroless Ag plating was conducted in an ammonia-free bath.The Ag implantation pretreatment mainly includes three steps:(a)ultrasonic degreasing in acetone;(b)swelling in a silver nitrate/dimethyl sulfoxide aqueous solution for implanting Ag+into the surface of PMIA;and(c)reduction by NaBH4.Ethylenediamine and disodium ethylenediaminetetraacetate were used as complexing agents for replacing ammonia water in the electroless Ag plating bath.The Ag coating prepared by the described method had a smooth,level,and compact surface with good mechanical properties,thermal stability,and electrical conductivity.Its sheet resistance was 20-30 mΩ/sq and its electromagnetic shielding effectiveness was 68.23 dB in the frequency range of 30-3000 MHz.

关 键 词：间位芳纶 化学镀银 催化剂植入 无氨水镀浴 电磁屏蔽效能 

分 类 号：TQ153.16[化学工程—电化学工业]