耐电晕聚酰亚胺薄膜研究进展  

Research Progress of Corona Resistant Polyimide Films

作　　者：李清玲 刘存生 翁梦蔓 刘屹东 张继升 马小华 闵永刚 LI Qingling;LIU Cunsheng;WENG Mengman;LIU Yidong;ZHANG Jisheng;MA Xiaohua;MIN Yonggang(School of Materials and Energy,Guangdong University of Technology,Guangzhou 510006,China;Dongguan South China Design Innovation Institute,Dongguan 523808,China;Huimai Material Technology(Guangdong)Co.,Ltd.,Foshan 528200,China)

机构地区：[1]广东工业大学材料与能源学院,广东广州510006 [2]东莞华南设计创新院,广东东莞523808 [3]慧迈材料科技(广东)有限公司,广东佛山528200

出　　处：《绝缘材料》2021年第8期1-7,共7页Insulating Materials

基　　金：广东省“珠江人才计划”引进创新创业团队资助项目(2016ZT060412);广东工业大学百人计划(220418095);佛山市科技创新团队(1920001000108)。

摘　　要：本文综述了国内外耐电晕聚酰亚胺薄膜的专利布局、无机纳米杂化薄膜耐电晕性能的影响因素,介绍了耐电晕聚酰亚胺薄膜在液氮温度下的应用现状,并对耐电晕聚酰亚胺未来的发展方向进行了展望。This paper summarized the global patent layout of corona resistant PI films, the influencing factors of corona resistance for inorganic nano hybrid films, and introduced the application status of corona resistant PI films at liquid nitrogen temperature, as well as the future development of corona resistant PI films.

关 键 词：聚酰亚胺 专利布局 影响因素 低温应用 

分 类 号：TM215.13[一般工业技术—材料科学与工程]