谈一种埋置铝基板的塞孔方法  

A method of hole plugging on embedded high thermal conductivity aluminum board

作　　者：蒋华 郭宇 谢易松 张亚锋 Jiang Hua;Guo Yu;Xie Yisong;Zhang Yafeng(Victory Giant Technology(Hui Zhou)Co.,Ltd.Guang Dong,Postcode:516211)

机构地区：[1]胜宏科技(惠州)股份有限公司,广东惠州516211

出　　处：《印制电路信息》2021年第8期60-62,共3页Printed Circuit Information

摘　　要：电子产品的体积越来越小,功率密度越来越大,器件运行时产生的热量越来越多,如何散热就成为电子产品开发商最棘手的问题,用埋置铝基板的应用越来越广泛,需求量也越来越大。埋置铝基板,需要重点管控的是铝基芯板树脂塞孔与压合后导通孔的匹配。本文主要通过对大孔径树脂塞孔铝基板的生产流程进行研究,并总结出一种能适合埋置铝基板塞孔的生产制作流程。The electronic products are getting smaller and smaller,and the power density is getting larger and larger.The heat generated during the operation of the devices is increasing.How to dissipate heat has become the most difficult problem for electronic product developers.The corresponding embedded aluminum substrate is more and more widely used,and the demand is also increasing.The embedded aluminum substrate needs to be controlled mainly in the production process of the aluminum substrate hole epoxy resin plugging,and the deviation of the plug hole and the through hole after lamination.In this paper,it mainly studies the production process of large hole resin plug of aluminum substrate,and makes summary of a production process suitable for embedded aluminum substrate with hole epoxy plugging.

关 键 词：埋置高导热铝基板 塞孔 铝基板压合 

分 类 号：TN41[电子电信—微电子学与固体电子学]