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作 者:朱彦鹏 黄葳 陈朝霞 李岩 熊宇 ZHU Yanpeng;HUANG Wei;CHEN Zhaoxia;LI Yan;XIONG Yu(Department of Oral and Maxillofacial Surgery,First Affiliated Hospital,Army Medical University(Third Military Medical University),Chongqing,400037,China)
机构地区:[1]陆军军医大学(第三军医大学)第一附属医院口腔科,重庆400038
出 处:《第三军医大学学报》2021年第16期1593-1597,共5页Journal of Third Military Medical University
基 金:国家自然科学基金面上项目(81671022);陆军军医大学临床技术创新培育项目(CX2019LC106)。
摘 要:目的分析静态载荷下全酸蚀和自酸蚀牙本质粘接界面结构对其应力分布的影响,以了解应力载荷下两种粘接界面的功能状态。方法依据全酸蚀和自酸蚀粘接界面的微观形貌特点构建理想化三维有限元模型,设定边界条件及力学参数后加载20 MPa静态拉伸载荷,比较两种粘接界面的应力分布特点及各结构单元的应力集中因子。结果静态载荷下粘接界面各结构成分承受不同程度的拉伸应力,应力集中主要出现在不同结构成分交界面,全酸蚀粘接界面中部分脱矿牙本质的应力集中因子最大(2.91),而自酸蚀粘接界面中正常牙本质的应力集中因子最高(2.52)。自酸蚀粘接界面中的应力水平(50.32 MPa)低于全酸蚀粘接界面(58.27 MPa)。结论基于本研究构建的两种粘接界面模型,自酸蚀粘接界面较全酸蚀粘接界面有更好的力学稳定性。Objective To analyze the effect of total etching and self-etching adhesive systems on resin-dentin interfaces and stress distribution under static tensile loading in order to understand the function of 2 interfaces under static loading.Methods Two idealized micro-scaled three-dimensional finite element models were constructed according to the micromorphological characteristics of the total etching and self-etching adhesive system bonded dentin interfaces.The stress distribution of the 2 interfaces was analyzed under a static tensile load of 20 MPa,as well as stress concentration factors of each structural components were calculated.Results The structural components of both bonded interfaces were subjected to tensile stress under static tensile loading,as the stress was concentrated predominantly at the junctions of different structural components.The highest stress concentration factor was found in the partially demineralized dentin in the total etching bonded interface(2.91),and the factor was 2.52 in the intact dentin in the self-etching bonded interface.The stress was lower in the self-etching bonded interface than the total etching bonded interface(50.32 vs 58.27 MPa).Conclusion Based on the 2 micro-scaled interfacial models constructed in this study,the mechanical stability of self-etching bonded interface is much better than that of the total etching bonded interface.
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