BMI-5100双马来酰亚胺树脂的固化动力学研究  

Study on curing kinetics of BMI-5100 bismaleimide resin

作　　者：胡亚坤 粟俊华 张赛 席奎东 乔文强 王植源 HU Ya-kun;SU Jun-hua;ZHANG Sai;XI Kui-dong;QIAO Wen-qiang;WANG Zhi-yuan(Deparment of Polymer Science,School of Chemical Engineering,Dalian University of Technology,Dalian 116024,China;Nanya New Material Technology Co.,Ltd.Shanghai 201802,China)

机构地区：[1]大连理工大学化工学院高分子材料系,辽宁大连116024 [2]南亚新材料科技股份有限公司,上海201802

出　　处：《热固性树脂》2021年第4期20-24,共5页Thermosetting Resin

摘　　要：采用示差扫描量热法(DSC)研究了BMI-5100双马来酰亚胺树脂及其加入质量分数5%的双叔丁基过氧异丙基苯(BIBP)固化剂体系的固化反应动力学。通过线性拟合得到BMI-5100树脂体系的特征温度及固化动力学参数。结果表明:纯BMI-5100的非等温固化DSC曲线呈现单峰反应,其凝胶温度、固化温度和后处理温度分别为216.5,277.1,317.5℃,表观活化能E为90.7 kJ/mol,指前因子A为5.3×10^(7)、反应级数n为0.872。含固化剂体系的固化过程出现了2个固化峰,第1固化峰所对应的凝胶温度、固化温度和后处理温度分别为143.1,150.1,164.2℃,第2固化峰相应温度分别为164.2,181.3,208.7℃,表明固化剂的加入可以明显降低BMI-5100树脂的固化温度并提高固化速率。The curing reaction kinetics of pure BMI-5100 bismaleimide resin and the system containing 5 wt%curing agent bis-tertbutylperoxyisopropylbenzene(BIBP)were studied by DSC.The characteristic temperature and curing kinetic parameters of the BMI-5100 resin system were obtained by linear fitting.The results showed that the non-isothermal curing DSC curve of pure BMI-5100presented a unimodal reaction.The gel temperature,curing temperature and post-treatment temperature were 216.5,277.1,317.5℃,respectively,and the apparent activation energy E,frequency factor A and the reaction order n were 90.7 kJ/mol,5.3×10^(7) and 0.872,respectively.The curing process of the curing agent-containing system had two curing peaks.The gel temperature,curing temperature and post-treatment temperature corresponding to the first curing peak were 143.1,150.1,164.2℃,respectively,and those of the second curing peak were 164.2,181.3,208.7℃,respectively.The results showed that the addition of curing agent could significantly reduce the curing temperature of BMI-5100 resin and increase the curing rate.

关 键 词：BMI-5100树脂 示差扫描量热法 固化动力学 固化温度 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]