金属封装功率器件管壳镀金层腐蚀机理研究  

Research on Corrosion Mechanism of Gold-plated Layer of Housings of Metal Package Power Device

作　　者：李寿全 LI Shouquan(Beijing New Energy Vehicle Technology Innovation Center Co.,Ltd.,Beijing 100029,China)

机构地区：[1]北京新能源汽车技术创新中心有限公司,北京100029

出　　处：《电子产品可靠性与环境试验》2021年第4期19-25,共7页Electronic Product Reliability and Environmental Testing

摘　　要：金属封装形式的氧化物半导体场效应晶体管(VDMOS),在经历筛选试验后,管壳表面的金属层出现了腐蚀形貌,通过显微镜观察、扫描电镜、EDS能谱分析和切片镜检等方法,对腐蚀样品进行了分析,确定了失效原因,并详细地阐述了腐蚀发生的机理。For VDMOS devices in the form of metal packaging,after undergoing screening tests,the metal layer on the surface of the housings shows corrosion morphology.The corrosion samples are analyzed through microscope observation,scanning electron microscopy,EDS analysis,and section microscopy.The reason for the failure is determined and the mechanism of corrosion is explained in detail.

关 键 词：功率器件 管壳腐蚀 失效分析 氧化物半导体场效应晶体管 

分 类 号：TN32[电子电信—物理电子学]