硅杂化环氧树脂胶接性能研究  

Research of Adhesive Properties of Silicon Hybrid Epoxy Resin

作　　者：荣立平 刘松浩 刘晓辉[1] 王刚[1] 朱金华[1] Rong Liping;Liu Songhao;Liu Xiaohui;Wang Gang;Zhu Jinhua(Institute of Petroleum Chemistry, Heilongjiang Academy of Sciences, Harbin 150001, China)

机构地区：[1]黑龙江省科学院石油化学研究院,哈尔滨150001

出　　处：《黑龙江科学》2021年第16期1-3,7,共4页Heilongjiang Science

基　　金：黑龙江省科学院杰出青年基金资助项目。

摘　　要：采用溶胶-凝胶法制备一种新型硅杂化双酚A环氧树脂(E-51),该树脂采用聚醚胺(D230)作固化剂。杂化树脂固化后,室温、80℃时剪切强度分别较未杂化树脂提高13%和21%,玻璃化温度提高4.9℃,失重5%时的温度提高17℃,400℃失重率减少了3%。A new kind of silicon-hybrid bisphenol A epoxy resin(E-51)was prepared by sol-gel method,and the polyether amine(D230)was used as a curing agent.The shear strength of the cured hybrid resin at room temperature and 80℃was increased by 13%and 21%,respectively.The glass transition temperature was increased by 4.9℃,the temperature at 5%weight loss was increased by 17℃,and the weight loss rate at 400℃was reduced by 3%,compared with that of the non-hybrid E-51.

关 键 词：溶胶-凝胶 环氧树脂 剪切强度 玻璃化温度 

分 类 号：Tu58[建筑科学—建筑技术科学]