芯片式压力传感器标定平台实现  

Realization of calibration platform for chip pressure sensor

作　　者：杨文涛 冯则坤 刘长华 戴建飞 YANG Wentao;FENG Zekun;LIU Changhua;DAI Jianfei(School of Optics and Electronics,Huazhong University of Science and Technology,Wuhan 430074,China;Nanchang Gongkong Electric Equipment Co Ltd,Nanchang 330001,China)

机构地区：[1]华中科技大学光电学院,湖北武汉430074 [2]南昌工控电装有限公司,江西南昌330001

出　　处：《传感器与微系统》2021年第9期114-116,120,共4页Transducer and Microsystem Technologies

摘　　要：论述了芯片式传感器的结构组成、基本工作原理和标定过程。依据桥式传感器的温度漂移和非线性补偿多项式模型,分析了传感器的标定和调理过程,在此基础上,提出了芯片式传感器的标定平台系统方案。标定平台以传感器信号调理通信板、批量标定板、传感器设备单元为基础,PC端上位机集成了可编程逻辑控制器(PLC)、调温调压设备等控制设备,实现了传感器的批量自动化配置、测量、标定和检测等工作。所设计的标定平台能够有效地满足实际生产中大批量传感器产品的标定任务要求。Structure,basic working principle and calibration process of the chip sensor are discussed.On the basis of the temperature drift and nonlinear compensation polynomial model for bridge sensor,the calibration and conditioning process of sensor are analyzed and a calibration platform system scheme of chip sensor is proposed.In this scheme,the calibration platform is based on sensor signal conditioning communication board,mass calibration board and sensor device unit,upper PC integrates programmable logic controller(PLC)control unit,temperature and pressure regulating equipment and realize batch automatic configuration,measurement,calibration and detection of sensors.The calibration platform can effectively meet the requirements of calibration tasks for mass sensor products in actual production.

关 键 词：芯片式压力传感器 温度漂移 标定与调理 

分 类 号：TP21[自动化与计算机技术—检测技术与自动化装置]