Development of sandwich joining piece to fabricate segmented half-Heusler/skutterudite thermoelectric joints  

作　　者：Wei-An Wang Xiao-Ya Li Yun-Fei Xing Ming Gu Long-Hui Fang Ye-Feng Bao Jin-Hui Fan 

机构地区：[1]School of Mechanical and Electrical Engineering,Hohai University,Changzhou 213022,China [2]The State Key Lab of High Performance Ceramics and Superfine Microstructure,Shanghai Institute of Ceramics,Chinese Academy of Sciences,Shanghai 200050,China [3]School of Mechanical Engineering,Donghua University,Shanghai 201620,China

出　　处：《Rare Metals》2021年第7期1966-1970,共5页稀有金属（英文版）

基　　金：the National Natural Science Foundation of China(Nos.U1738114,51372261 and 51879089)。

摘　　要：Sn/Ni-Sn/Sn sandwich joining piece was developed and applied to fabricate segmented half-Heusler/skutterudite thermoelectric joints,and high-temperature service behavior of the joints was studied.The microstructure and contact resistance of the joint before and after aging were investigated.The joints are well bonded and no cracks appear at the interfaces of the joint before and after aging,which can be attributed to the formation of high-melting point intermetallic compounds.The electrical resistance crosses the joining layer smoothly and the contact resistance is low.These results show that the sandwich joining piece is effective and flexible,and promising for the preparation of segmented thermoelectric devices.

关 键 词：Sandwich joining piece Segmented thermoelectric joint Microstructure Contact resistance 

分 类 号：TG407[金属学及工艺—焊接] TB34[一般工业技术—材料科学与工程]