一种基于X射线成像的球栅网格阵列封装芯片焊接检测方法  

An automatic detection method of ball grid array packaging chip welding based on X-ray image

作　　者：冯辰越 黄慧 马燕[1] FENG Chenyue;HUANG Hui;MA Yan(College of Information,Electrical and Mechanical Engineering,Shanghai Normal University,Shanghai 201418,China)

机构地区：[1]上海师范大学信息与机电工程学院,上海201418

出　　处：《上海师范大学学报（自然科学版）》2021年第4期408-412,共5页Journal of Shanghai Normal University(Natural Sciences)

摘　　要：球栅网格阵列(BGA)封装芯片由于其引脚封装在内部的工艺特点,需要采用X射线成像的方式进行质量检查.提出一种基于印制电路板(PCB)X射线图像的自动芯片焊接质量检测方法,采用投影变换的方法确定芯片区域,根据球形焊点特点,利用霍夫变换对引脚焊点进行自动识别.该方法能实现全自动的焊接质量检查,提高焊点识别的效率和准确度,进而提高工业生产的效率和可靠性.The ball grid array(BGA)packaging chip had to be detectedby X-ray image because of its internal pin package process characteristics.An automatic quality detection method of chip welding based on X-ray image for printed circuit board(PCB)was presented in this paper,which determined the chip area by the method of projection transformation.According to the characteristics of the spherical solder joints,the pin solder joints were recognized automatically by Hough transform.The proposed method could fully realize the detection of welding quality automatically and improve the efficiency and accuracy of the solder joints detection.Besides,the efficiency and reliability of the industrial production could also be improved.

关 键 词：印制电路板(PCB) X射线 数字图像处理 霍夫变换 

分 类 号：TP391.4[自动化与计算机技术—计算机应用技术]