工艺条件对线路板化学镀钯的影响分析  

Influence of Process Conditions on Electroless Palladium Plating on Circuit Boards

作　　者：刘贺 Liu He(Zhaoqing Guohua Electronics Co.,Ltd.,Guangdong,526040)

机构地区：[1]肇庆国华电子有限公司,广东526040

出　　处：《当代化工研究》2021年第17期135-136,共2页Modern Chemical Research

摘　　要：对线路板化学镀钯的相关内容进行研究,认识到工艺条件对其影响因素,核心目的是通过各项影响问题的探究,确定线路板的工艺条件,避免表面腐蚀问题的出现,从而确定最佳的工艺条件。This paper studies the related contents of electroless palladium plating on circuit boards,and it was realized that the core purpose of influencing factors of process conditions was to determine the process conditions of circuit boards and avoid surface corrosion,so as to determine the best process conditions.

关 键 词：工艺条件 线路板 化学镀钯 

分 类 号：T[一般工业技术]