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作 者:王德波 王艺臻[1] 赵志斌 Wang Debo;Wang Yizhen;Zhao Zhibin(School of Physics and Electronic Engineering,Hainan Normal University,Haikou 571158,Hainan,China)
机构地区:[1]海南师范大学物理与电子工程学院,海南海口571158
出 处:《中国胶粘剂》2021年第8期11-16,共6页China Adhesives
基 金:海南省自然科学基金资助项目(519MS051)。
摘 要:以金属氧化物和金属氮化物为导热填料,制备双组分缩合型导热有机硅胶粘剂,研究了单一填料种类及用量、不同种类填料混配及填料表面处理对导热胶粘剂性能的影响。研究结果表明:当使用单一填料时,胶粘剂的导热性能随着导热填料用量的增加而增大;在填充份数相同时,胶粘剂的导热性能从高到低依次为AlN>Si_(3)N_(4)>MgO>Al_(2)O_(3),而工艺性能正好相反。当使用混合填料时,以Al_(2)O_(3)为基础,混入不同比例的Si_(3)N_(4)、AlN和MgO,结果发现不同的混配填料体系均存在最佳的配比;在该配比时体系内填料达到致密堆积,从而获得良好的导热系数和工艺性能,其中Al_(2)O_(3)/Si_(3)N_(4)和Al_(2)O_(3)/AlN体系的最高导热系数分别为1.18和1.27 W(/m·K),比使用单一氧化铝填料的体系分别提高了33%和43%。采用偶联剂处理氧化铝可提高填料与树脂的相容性,降低填料与树脂的界面接触热阻,进一步提高胶粘剂的导热性能和工艺性能。Two-component condensed thermal conductive silicone adhesive was prepared with metal oxide and metal nitride as thermal conductive filler.The effects of the type and amount of single filler,the mixing of different types of filler and the surface treatment of filler on the properties of thermal conductive adhesive were studied.The research results showed that when single filler was used,the thermal conductivity of adhesive increased with the increase of the amount of thermal conductive filler.When the amount of filler was the same,the thermal conductivity of adhesive was followed by the order AlN>Si_(3)N_(4)>MgO>Al_(2)O_(3)from high to low,but the process performance was just the opposite.When mixed fillers were used and based on Al2O3,then mixed with different proportions of Si_(3)N_(4),AlN and MgO,the results showed that different mixed filler systems had the best proportions.At these proportions,the filler in the system was densely packed,thereby obtaining good thermal conductivity and process performance.Among them,the highest thermal conductivity of Al_(2)O_(3)/Si_(3)N_(4)and Al_(2)O_(3)/AlN systems was 1.18 and 1.27 W/(m·K),respectively,which was increased by 33%and 43%,respectively,compared with the system using single alumina filler.Treating alumina with coupling agent could improve the compatibility of filler and resin,reduce the thermal resistance of interfacial contact between filler and resin,and further improve the thermal conductivity and process performance of adhesive.
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