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作 者:健男 尹美杰 张熙 刁东风[1] JIAN Nan;YIN Meijie;ZHANG Xi;DIAO Dongfeng(Electron Microscope Center,Shenzhen University,Shenzhen 518060,Guangdong Province,P.R.China)
出 处:《深圳大学学报(理工版)》2021年第5期441-452,共12页Journal of Shenzhen University(Science and Engineering)
基 金:国家自然科学基金资助项目(51975383,11904235)
摘 要:高分辨透射电子显微镜(transmission electron microscopy,TEM)原位实验是在纳米乃至皮米尺度上实时研究物质在不同场环境中的原子和电子结构变化、探寻材料在使役条件下性能根源的一类实验研究方法,在基础科学探索与产业技术研发的源头创新中起着不可或缺的作用.本文详细介绍了高分辨透射电镜原位实验研究的技术原理以及应用进展.按照原位电镜实验实现手段进行分类,概述原位电子束照射、环境透射电镜、四维超快电镜、原位加热、加电、力学、光学、液体、气体样品杆等各类高分辨原位电镜实验的实验技术、原理以及应用的最新进展.随着技术的进步,高分辨原位电镜实验正向着芯片化、复合化和定量化的方向发展,而目前所遇到的电子束、磁场的干扰以及成像速度问题相信在不远的将来会得到解决.In situ high-resolution transmission electron microscopy(TEM)is an experimental technique for exploring how the properties of a material arise from its atomic and electronic structure,at the nanometer or even picometer scale,under working conditions.It can also be used to study how those structures may evolve under the influence of applied electric and magnetic fields.It is one of the most important research areas in high-resolution TEM research,which is playing an indispensable role in driving innovation in both fundamental research and the development of industrial technology.This review introduces the basic principles,experimental technology,and recent progress in the application of the various kinds of in situ high-resolution TEM.Trends in the future development of in situ high-resolution TEM include a push towards chip-based implementation,multi-stimulus/environment integration,and more precise quantification of results.Efforts are also underway to overcome the challenges posed by electron irradiation damage,disturbance by magnetic fields,and limited imaging speeds.
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