PECVD在挠性电路板防护中的应用研究  

Application and research of PECVD in FPCB protection

作　　者：曹建诚 胡宗敏 Cao Jiancheng;Hu Zongmin(MFLEX Suzhou Co.,Ltd.,Suzhou,Jiangsu 215000)

机构地区：[1]苏州维信电子有限公司,江苏苏州215000

出　　处：《印制电路信息》2021年第9期27-31,共5页Printed Circuit Information

摘　　要：随着挠性电路板应用领域的增多,使用环境和可靠性要求越来越高,尤其是在耐腐蚀性方面提出了更高的要求。本文通过PECVD的方式在挠性电路板金面沉积一层纳米聚合物薄膜形成防护膜,以此来提高金面的耐盐雾性能,提升其使用寿命。As the application fields of flexible printed circuit boards(FPCB)increase,the requirements for its use environment and reliability are getting higher and higher,especially in terms of corrosion resistance.In this paper,a nano-polymer film is prepared on the FPCB golden surface by PECVD,which has a barrier and protection effect on the gold surface,so that it is not corroded by the external environment.By this way,the salt spray resistance of the FPCB golden surface is improved,and its service life is increased.

关 键 词：挠性电路板 等离子增强型化学气相淀积 防护膜 耐盐雾性能 

分 类 号：TN41[电子电信—微电子学与固体电子学]