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作 者:吴科鹏 张榜 缪馥星[1,2] Wu Kepeng;Zhang Bang;Miao Fuxing(Key Laboratory of Impact and Safety Engineering,Ministry of Education,Ningbo University,315211,Ningbo,China;State Key Laboratory for Strength and Vibration of Mechanical Structures,Xi’an Jiaotong University,710049,Xi’an,China)
机构地区:[1]宁波大学冲击与安全工程教育部重点实验室,宁波315211 [2]西安交通大学机械结构强度与振动国家重点实验室,西安710049
出 处:《应用力学学报》2021年第4期1523-1530,共8页Chinese Journal of Applied Mechanics
基 金:国家自然科学基金(11572161,11872218);浙江省“近海结构冲击安全防护与健康监测”重点科技创新团队(2013TD21);机械结构强度与振动国家重点实验室(SV2016-KF-17)。
摘 要:应用ABAQUS建立了柔性基/硅层合悬臂梁有限元模型,计算了在位移载荷下,柔性基/硅层合悬臂梁中硅层的应力变化,分析了层厚比的变化对柔性基/硅层合悬臂梁低阶固有频率以及振动响应的影响,并与铝基层合悬臂梁进行了对比。结果表明:柔性基可以大幅减小硅层上的应力;封装层和硅层的层厚比越大,柔性基/硅层合悬臂梁的低阶固有频率越大;同时,位移和速度响应明显减小,响应的周期也减小。表明增大封装层和硅层的层厚比,可以有效地提高柔性基/硅层合悬臂梁的整体性能和稳定性,提高其抗冲击性能。反之,会增大柔性基/硅层合悬臂梁发生共振现象的概率,不利于其整体稳定性的提升。此研究结果可为柔性电子器件结构振动特性的优化设计提供理论参考。The finite element model of flexible substrate/silicon laminated cantilever beam is established by ABAQUS, and the stress on the silicon layer in the flexible substrate/silicon laminate cantilever beam with displacement load are calculated, influence of layer thickness ratio is analyzed for the low-order natural frequency and vibration response of the flexible substrate/silicon laminated cantilever beam, and with the aluminum substrate laminated cantilever beam is compared. Simulation results indicate that the stress on the silicon layer with flexible substrate is greatly reduced. And large ratio for encapsulation/silicon, the low-order natural frequency is increased, while the displacement and velocity response are dramatically decreased, the vibration period also decreased. This therefore improves overall performance, reliability, stability, and impact resistance of the cantilever beam. On the contrary, the flexible substrate/silicon laminated cantilever beam occurs probability resonance phenomenon is increased to enhance the overall detrimental to their stability. Overall, this study provides significant insights for structural optimization of flexible electronic devices and design guidelines on engineer applications.
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