Migration regularities of impurity aluminum and copper in purification of metal lanthanum by solid-state electrotransport  被引量:2

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作  者:Zhi-Qiang Wang Zong-An Li Jia-Min Zhong De-Hong Chen Xiao-Wei Zhang Lin Zhou 

机构地区:[1]National Engineering Research Center for Rare Earth Materials,Grirem Advanced Materials Co.,Ltd.,General Research Institute for Nonferrous Metals,Beijing,100088,China

出  处:《Rare Metals》2021年第8期2307-2312,共6页稀有金属(英文版)

基  金:financially supported by the National Basic Research Program of China(No.2012CBA01207);the National High Technology Research and Development Program of China(No.2011AA03A409)。

摘  要:In view of the previous studies on the migrations of impurity aluminum(Al)and copper(Cu)in purification of rare earth metal by solid-state electrotransport(SSE),there are still some questions about that which direction they migrate to and whether there are significant migrations or not.The metal lanthanum(La)was used as research object,and the effects of migration temperature and time on the distributions and migration regularities of impurity Al and Cu were investigated in the present study by increasing concentration of impurity Al and Cu in raw metal La.The impurity migration direction and removal difficulty were intuitively judged by the residual rate distribution curve of impurity.It is indicated that metal impurity Al and Cu in metal La at 800℃ with direct current are found to significantly migrate to anode and their residual rates near cathode decrease with the increase in migration temperature and prolongation of migration time.The relatively large vapor pressure of Al and Cu makes their residual rate distribution curves being low in middle and high in ends.When metal La was continuously purified for 100 h at 800℃ by SSE,the residual rates of impurity Al and Cu at 20 mm from cathode are 68.43%and 57.43%,respectively,showing that Cu is much easier to be removed than Al.

关 键 词:Solid-state electrotransport PURIFICATION Residual rate Rare earth metal LANTHANUM 

分 类 号:TF845[冶金工程—有色金属冶金]

 

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