不同影响因素下相变温控组件温控性能对比分析  

The Performance Comparisons of Thermal Control Component under Different Influence Factors

作　　者：苏欣 SU Xin(Southwest Institution of Electronic Technology,Chengdu 610036)

机构地区：[1]西南电子技术研究所,成都610036

出　　处：《环境技术》2021年第4期133-137,共5页Environmental Technology

摘　　要：本文对泡沫石墨/石蜡复合相变温控组件的相变温控过程进行了数值模拟分析,通过改变芯片的加热功率和面积,分析其对相变温控过程的影响。研究表明,功率越大,芯片温升速率越大,温度稳定时间越短;增大芯片面积可使相变材料的熔化更加均匀。This paper gives a numerical simulation analysis based on thermal control component filled with graphite foam.By change the heating power and area of the chip,the phase change temperature control process is compared.The research results show when the heating power is greater,the chip heating rate is increasing and the temperature stabilization time is shortened at the same time.When the chip’s heating area is bigger,the phase change material’s melting process is much more evenly.

关 键 词：相变温控组件 数值模拟 泡沫石墨 

分 类 号：TK02[动力工程及工程热物理]