微波多功能组件一体化焊接工艺方法  

Integrative Soldering Process of Microwave Multifunctional Modules

作　　者：陈梁[1] 贾伏龙 陆乐[1] 崔洪波[1] CHEN Liang;JIA Fulong;LU Le;CUI Hongbo(The 55th Research Institute of CETC,Nanjing 210016,China)

机构地区：[1]中国电子科技集团公司第五十五研究所,江苏南京210016

出　　处：《电子工艺技术》2021年第5期292-294,共3页Electronics Process Technology

摘　　要：从产品的可制造性设计、工艺设计、工装设计等方面入手,研究微波多功能组件的一体化焊接工艺。通过优化焊接工艺、合并焊接工序、减少温度梯度,并结合自动化平台和一体化工装,实现多种电路板、隔墙等叠加焊接,以及有高度差的电路板、垂直和水平接插件、元器件等部件的同时焊接,同时能有效减少手工操作带来的误差,提高产品装配的一致性和可靠性,从而替代传统的焊接工艺,满足小型化和高集成微波多功能组件的工艺装配需求。The integrative soldering process of microwave multifunctional components is studied from the aspects of manufacturability design,process design and tooling design.Through improving soldering process,merging soldering procedure,reducing temperature gradient,combining the automation platform and integrative tooling,it can realize overlay soldering of circuit boards and partition wall,as well as solder circuit boards of different height,coaxial connectors of vertical and level plane,electronic components,manual errors can be effectively reduced,assembly consistency and product reliability is improved.Then it can be substitute for traditional soldering technology,and meet the requirements of the assembly technique of the miniaturization and high-integrity.

关 键 词：多功能组件 一体化焊接 可制造性设计 工艺设计 工装设计 

分 类 号：TN605[电子电信—电路与系统]