锡膏量与再流焊后焊点形貌关系分析  

Analysis of Relationship between Solder Paste Quantity and Solder Joint Morphology

作　　者：宋栋 赵丽[1] SONG Dong;ZHAO Li(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2021年第5期307-310,共4页Electronics Process Technology

摘　　要：表面贴装技术中的钢网设计是决定焊膏沉积量的关键因素,而再流焊后形成的焊点形貌与钢网的开口设计有着千丝万缕的联系。从SMT锡膏印刷工艺的理论基础出发,结合实际PCB(印制线路板)上锡膏印刷量,针对在不同线宽的高速信号线衍生形成的焊盘上印刷不同体积的锡膏量,论证再流焊后形成的焊点形貌。The stencil design in SMT is a key factor to determine the volume of solder paste deposition,and shape of the reflow solder joint is closely related to the design of the stencil.Based on the theoretical basis of SMT solder paste printing process,combined with the actual volume of solder paste printed on PCB,aiming at the amount of solder paste with different volumes on the solder pads generated by high-speed signal lines of different line widths,the shape of the solder point morphology formed after reflow is verified.

关 键 词：锡膏印刷 锡膏量 焊盘尺寸 焊点形貌 高速信号 

分 类 号：TN605[电子电信—电路与系统]