电弧沉积TiSiN涂层的制备工艺研究  

Preparation of Arc Deposited TiSiN Coatings

作　　者：梁云鹏 曹时义 王俊锋 王启民[1] 代伟[1] LIANG Yunpeng;CAO Shiyi;WANG Junfeng;WANG Qimin;DAI Wei(Guangdong University of Technology,Guangzhou 510006,Guangdong,China;Guangdong Dtech Technology Co.,Ltd,Dongguan 523900,Guangdong,China)

机构地区：[1]广东工业大学,广东广州510006 [2]广东鼎泰高科技术股份有限公司,广东东莞523900

出　　处：《陶瓷学报》2021年第4期652-657,共6页Journal of Ceramics

基　　金：企业横向项目(607200040)。

摘　　要：采用脉冲电弧沉积技术制备了TiSiN涂层,研究了不同沉积参数(负偏压、靶电流及脉宽)对涂层结构和性能的影响。利用电子能谱仪、X射线衍射仪、纳米压痕仪、划痕仪等对涂层成分、结构、力学性能及结合力等参数进行了表征。结果表明,负偏压的增大引起TiSiN涂层内应力增大,表面刻蚀效果增强,涂层表面粗糙度上升且涂层硬度下降。靶电流的增加使涂层沉积速率上升,涂层表面大颗粒增加,粗糙度上升。脉宽减少后涂层内应力下降,涂层硬度从31 GPa升至40 GPa,涂层结合力得到增强。通过优化脉冲电弧沉积参数,适当采用低负偏压、低脉宽及低靶电弧,可获得高硬度、低应力、结合力强及表面光滑的TiSiN涂层。TiSiN coating was deposited by using pulsed arc deposition technology,whereas the influence of deposition parameters,including back bias voltage,target current and pulse width,on structure and performance of the coatings was studied.The composition,structure,mechanical properties and bonding strength of the coatings were characterized by using electron spectrometer,X-ray diffractometer,nanoindenter and scratcher.It was found that the increase in back bias voltage resulted in increase in the internal stress,surface etching resistance and surface roughness,while the hardness of the coating was decreased.Meanwhile,an increase in the target current accelerated the deposition rate.As the particle size was increased,the surface roughness was increased.With decreasing pulse width,the internal stress of the coating was reduced,and the coating hardness was increased up to 40 GPa and the adhesion was enhanced.By optimizing the pulse arc deposition parameters,using a suitable low back bias voltage,low pulse width and low target arc,TiSiN coatings,with high hardness,low stress,strong bonding and smooth surface,can be obtained.

关 键 词：多弧离子镀 TiSiN涂层 负偏压 涂层硬度 涂层结合力 

分 类 号：TQ174.75[化学工程—陶瓷工业]