Laser Erasing and Rewriting of Flexible Copper Circuits  

作　　者：Xingwen Zhou Wei Guo Peng Peng 

机构地区：[1]School of Mechanical Engineering and Automation,Beihang University,Beijing 100191,People’s Republic of China [2]Department of Mechanical and Mechatronics Engineering,Centre for Advanced Materials Joining,University of Waterloo,Waterloo,ON N2L 3G1,Canada

出　　处：《Nano-Micro Letters》2021年第11期409-420,共12页纳微快报（英文版）

基　　金：The authors acknowledge financial support from the National Key R&D Program of China(2017YFB1104900);the National Natural Science Foundation of China(51975033);the Beijing Natural Science Foundation(3192020);P.P.acknowledges support from NSERC discovery grant.X.Z.thanks Z.H.(College of Chemistry and Materials Science,Northwest University)for his support on XPS testing and analyzing.

摘　　要：Integrating construction and reconstruction of highly conductive structures into one process is of great interest in developing and manufacturing of electronics,but it is quite challenging because these two involve contradictive additive and subtractive processes.In this work,we report an all-laser mask-less processing technology that integrates manufacturing,modifying,and restoring of highly conductive Cu structures.By traveling a focused laser,the Cu patterns can be fabricated on the flexible substrate,while these as-written patterns can be selectively erased by changing the laser to a defocused state.Subsequently,the fresh patterns with identical conductivity and stability can be rewritten by repeating the writing step.Further,this erasing–rewriting process is also capable of repairing failure patterns,such as oxidation and cracking.Owing to the high controllability of this writing–erasing–rewriting process and its excellent reproducibility for conductive structures,it opens a new avenue for rapid healing and prototyping of electronics.

关 键 词：Laser writing Laser erasing Copper electrodes Electronic repairing Flexible electronics 

分 类 号：TN249[电子电信—物理电子学]