基于波峰焊料填充提升的可制造性设计优化研究  

Research on DFM optimization based on solder fill improvement of wave soldering

作　　者：何日吉 周舟 He Riji;Zhou Zhou(CEPREI,Guangzhou 510610 China)

机构地区：[1]中国赛宝实验室,广东广州510610

出　　处：《印制电路信息》2021年第10期12-15,共4页Printed Circuit Information

摘　　要：作为一种常见的电装工艺焊接方式,波峰焊的焊料填充高度是影响焊接可靠性的关键因素。文章介绍了波峰焊焊料填充的机理,并分析了过大孔径设计、瓶塞效应设计和铜箔实连接设计三种典型可制造性设计引起填充不足的原因,并探讨了有助于焊料填充提升的设计优化方案。As one of the common soldering methods of assembly process,the solder fill height of wave soldering is the key factor affecting soldering reliability.In this paper,the solder fill mechanism of wave soldering is introduced,and the insufficient solder fill reason of three classic poor DFM including overlarge aperture design,plugging effect design and full connected design are analyzed.Eventually,the optimization direction of DFM on solder fill improvement is also discussed as a reference in industry.

关 键 词：印制电路板 波峰焊 填充高度 可制造性 设计优化 

分 类 号：TN41[电子电信—微电子学与固体电子学]