过孔残根对信号完整性的影响  

The influence of stub through hole on signal integrity

作　　者：邱小华 杨鹏飞 曾宪悉 胡玉春 Qiu xiaohua;Yang Pengfei;Zeng Xianxi;Hu Yuchun

机构地区：[1]惠州中京电子科技有限公司,广东惠州519029

出　　处：《印制电路信息》2021年第10期16-19,共4页Printed Circuit Information

摘　　要：印制板上信号传输的高速化要求高效与低损耗,传输速率和频率的提高进一步加大了信号的损耗。内层带状线加通孔过孔的设计是最常见的一种信号传输模式。本文主要研究高速产品设计时内层信号线过孔时对阻抗以及损耗的相关影响。为高速信号在过孔传输中提高阻抗匹配度,降低损耗提供一些可行性建议。The high-speed trend of signal transmission puts forward higher requirements on the efficiency and low loss.The increase of transmission rate and frequency further increases the loss of signal.The Stripline and through-hole design is one of the most common signal transmission modes.This paper mainly studies the influence of the inner signal line through the hole on the impedance and loss in the design of high-speed products.Some feasible suggestions are provided for improving impedance matching and reducing loss in high-speed signal transmission through holes.

关 键 词：内层带状线 过孔 阻抗 信号损耗 印制电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学]