引线框架用铜镍硅合金研究现状及发展趋势  

Research Status and Development Trend of Copper-Nickel-Silicon Alloy for Lead Frame

作　　者：武安琪 王松伟 陈帅峰 李洋 刘劲松[1,2] 陈岩[2] 宋鸿武[2] WU An-qi;WANG Song-wei;CHEN Shuai-feng;LI Yang;LIU Jin-song;CHENYan;SONG Hong-wu(School of Material Science and Engineering,Shenyang Ligong University,Shenyang 110159,Liaoning,China;Shi-changxu Innovation Center for Advanced Materials,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,Liaoning,China)

机构地区：[1]沈阳理工大学材料科学与工程学院,辽宁沈阳110159 [2]中国科学院金属研究所,师昌绪先进材料创新中心,辽宁沈阳110016

出　　处：《铜业工程》2021年第4期14-20,共7页Copper Engineering

摘　　要：对近年来引线框架用铜镍硅合金种类和性能进行了综述,并阐述了铜镍硅合金相关强化机制。重点总结了铜镍硅合金力学性能和电导率与Ni、Si含量及不同微量元素添加之间的关系,同时简要介绍铜镍硅合金制备工艺及成形技术的发展现状。提出未来铜镍硅合金性能应满足强度达到750~840MPa,电导率达到35%IACS,其制备技术将向着高新技术集成化,规模化,绿色化方向发展。This article summarizes the types and properties of Cu-Ni-Si alloys used for lead frames in recent years,and the correlated strengthening mechanisms.Special attentions are paid to summary the relationship between the mechanical properties and electrical conductivity of the alloys and the contents of Ni,Si as well as the addition of different trace elements.Meanwhile,the development status of copper-nickel-silicon alloy preparation process and forming technology is briefly introduced.It is prospected that the performance of Cu-Ni-Si alloy should satisfy the strength of 750~840 MPa and the conductivity of 35%IACS in the future.And,its preparation technology will develop towards the direction featured with high-tech integration,large-scale fabrication,and green manufacturing concept.

关 键 词：铜镍硅合金 引线框架 成分设计 力学性能 电导率 

分 类 号：TG146.1[一般工业技术—材料科学与工程]